DF2134AFA20V Renesas Electronics America, DF2134AFA20V Datasheet - Page 1055

IC H8S/2100 MCU FLASH 80QFP

DF2134AFA20V

Manufacturer Part Number
DF2134AFA20V
Description
IC H8S/2100 MCU FLASH 80QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheets

Specifications of DF2134AFA20V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
IrDA, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
58
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
80-QFP
For Use With
3DK2166 - DEV EVAL KIT H8S/2166
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2134AFA20V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
E.1
(1) To retain RAM contents with the RAME bit set to 1 in SYSCR, drive the RES signal low 10
(2) To retain RAM contents with the RAME bit cleared to 0 in SYSCR, or when RAM contents do
E.2
Drive the RES signal low at least 100 ns before STBY goes high to execute a reset.
Appendix E Timing of Transition to and Recovery from
system clock cycles before the STBY signal goes low, as shown in figure E.1. RES must
remain low until STBY signal goes low (minimum delay from STBY low to RES high: 0 ns).
not need to be retained, RES does not have to be driven low as in (1).
STBY
RES
STBY
RES
Timing of Recovery from Hardware Standby Mode
Timing of Transition to Hardware Standby Mode
Figure E.2 Timing of Recovery from Hardware Standby Mode
Figure E.1 Timing of Transition to Hardware Standby Mode
Appendix E Timing of Transition to and Recovery from Hardware Standby Mode
Hardware Standby Mode
t
t
1
100 ns
10t
cyc
t
2
t
OSC1
Rev. 4.00 Jun 06, 2006 page 999 of 1004
0 ns
REJ09B0301-0400

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