DF2239TF16I Renesas Electronics America, DF2239TF16I Datasheet - Page 1036

MCU 3V 384K I-TEMP 100-TQFP

DF2239TF16I

Manufacturer Part Number
DF2239TF16I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of DF2239TF16I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
16MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2239TF16I
HD64F2239TF16I
Appendix C Package Dimensions
Rev. 6.00 Mar. 18, 2010 Page 974 of 982
REJ09B0054-0600
P-TQFP100-12x12-0.40
JEITA Package Code
S
100
76
Z
e
D
75
1
Index mark
RENESAS Code
PTQP0100LC-A
*1
H
D
D
y
S
*3
b
Figure C.2 TFP-100G Package Dimensions
p
51
25
x
50
26
TFP-100G/TFP-100GV
F
M
Previous Code
MASS[Typ.]
0.4g
Terminal cross section
Detail F
b
b
p
1
L
1
L
NOTE)
1. DIMENSIONS"*1"AND"*2"
2. DIMENSION"*3"DOES NOT
DO NOT INCLUDE MOLD FLASH
INCLUDE TRIM OFFSET.
Reference
Symbol
D
E
A
H
H
A
A
b
b
c
e
Z
Z
L
L
c
θ
x
y
p
1
1
D
E
1
2
D
E
1
Dimension in Millimeters
13.8
13.8
0.00
0.13
0.12
Min
0.4
Nom Max
14.0
14.0
1.00
0.10
0.18
0.16
0.17
0.15
0.4
1.2
1.2
0.5
1.0
12
12
14.2
14.2
1.20
0.20
0.23
0.22
0.07
0.10
0.6

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