DF2239TF16I Renesas Electronics America, DF2239TF16I Datasheet - Page 923

MCU 3V 384K I-TEMP 100-TQFP

DF2239TF16I

Manufacturer Part Number
DF2239TF16I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of DF2239TF16I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
16MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2239TF16I
HD64F2239TF16I
27.2.5
Table 27.11 lists the D/A conversion characteristics.
Table 27.11 D/A Conversion Characteristics
Condition A: V
Item
Resolution
Conversion time
Absolute accuracy
D/A Conversion Characteristics
V
specifications), T
CC
SS
= AV
= 4.0 V to 5.5 V, AV
SS
Min
8
= 0 V, φ = 10 to 13.5 MHz, T
a
= –40°C to +85°C (wide-range specifications)
Condition A
Typ
8
±2.0
CC
= 4.0 V to 5.5 V, V
Max
8
10
±3.0
±2.0
a
Rev. 6.00 Mar. 18, 2010 Page 861 of 982
= –20°C to +75°C (regular
ref
Section 27 Electrical Characteristics
Unit
bits
µs
LSB
LSB
= 4.0 V to AV
Test Conditions
Load capacitance: 20 pF
Load resistance: 2 MΩ
Load resistance: 4 MΩ
CC
,
REJ09B0054-0600

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