DF2239TF16I Renesas Electronics America, DF2239TF16I Datasheet - Page 680

MCU 3V 384K I-TEMP 100-TQFP

DF2239TF16I

Manufacturer Part Number
DF2239TF16I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of DF2239TF16I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
16MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2239TF16I
HD64F2239TF16I
Section 15 Serial Communication Interface (SCI)
15.7.8
When the GM bit in SMR is set to 1, the clock output level can be fixed with bits CKE0 and
CKE1 in SCR. At this time, the minimum clock pulse width can be made the specified width.
Figure 15.34 shows the timing for fixing the clock output level. In this example, GM is set to 1,
CKE1 is cleared to 0, and the CKE0 bit is controlled.
Rev. 6.00 Mar. 18, 2010 Page 618 of 982
REJ09B0054-0600
CKE0
SCK
Clock Output Control
No
Figure 15.33 Example of Reception Processing Flow
No
Figure 15.34 Timing for Fixing Clock Output Level
Specified pulse width
RDRF flag in SSR to 0
Read RDR and clear
All data received?
Clear RE bit to 0
ORER = 0 and
Start reception
Initialization
RDRF = 1?
PER = 0
Start
Yes
Yes
Yes
No
Specified pulse width
Error processing

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