DF2239TF16I Renesas Electronics America, DF2239TF16I Datasheet - Page 962

MCU 3V 384K I-TEMP 100-TQFP

DF2239TF16I

Manufacturer Part Number
DF2239TF16I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of DF2239TF16I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
16MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2239TF16I
HD64F2239TF16I
Section 27 Electrical Characteristics
Item
BREQ setup time
BACK delay time
Bus-floating time
Rev. 6.00 Mar. 18, 2010 Page 900 of 982
REJ09B0054-0600
WR delay time 1
WR delay time 2
WR pulse width 1
WR pulse width 2
Write data delay time
Write data setup time
Write data hold time
WAIT setup time
WAIT hold time
Symbol
t
t
t
t
t
t
t
t
t
t
t
t
BRQS
BACD
BZD
WRD1
WRD2
WSW1
WSW2
WDD
WDS
WDH
WTS
WTH
Min
1.0 × t
1.5 × t
0.5 × t
0.5 × t
50
10
50
cyc
cyc
cyc
cyc
Conditions A, B
– 30 ⎯
– 30 ⎯
– 37 ⎯
– 15 ⎯
Max
50
80
50
50
70
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Test Conditions
Figures 27.14 to
27.18
Figure 27.16
Figure 27.19

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