DF2239TF16I Renesas Electronics America, DF2239TF16I Datasheet - Page 867

• Manufacturer Part Number: DF2239TF16I
• Description: MCU 3V 384K I-TEMP 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2239TF16I

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2239TF16I; HD64F2239TF16I

Section 25 Power Supply Circuit
25.4
Note on Bypass Capacitor
A laminated ceramic capacitor of 0.01 μF to 0.1 μF should be inserted as a bypass capacitor in
each pair of V
and V
.
SS
CC
The bypass capacitor should be placed as close as possible to the power supply pin of this LSI.
The capacitance value and frequency characteristics should be used according to the operating
frequency of this LSI.
Rev. 6.00 Mar. 18, 2010 Page 805 of 982
REJ09B0054-0600