DF2239TF16I Renesas Electronics America, DF2239TF16I Datasheet - Page 341

MCU 3V 384K I-TEMP 100-TQFP

DF2239TF16I

Manufacturer Part Number
DF2239TF16I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of DF2239TF16I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
16MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2239TF16I
HD64F2239TF16I
Section 8 DMA Controller (DMAC)
8.7.7
Channel Re-Setting
To reactivate a number of channels when multiple channels are enabled, use exclusive handling of
transfer end interrupts, and perform DMABCR control bit operations exclusively.
Note, in particular, that in cases where multiple interrupts are generated between reading and
writing of DMABCR, and a DMABCR operation is performed during new interrupt handling, the
DMABCR write data in the original interrupt handling routine will be incorrect, and the write may
invalidate the results of the operations by the multiple interrupts. Ensure that overlapping
DMABCR operations are not performed by multiple interrupts, and that there is no separation
between read and write operations by the use of a bit-manipulation instruction.
Also, when the DTE and DTME bits are cleared by the DMAC or are written with 0, they must
first be read while cleared to 0 before the CPU can write 1 to them.
Rev. 6.00 Mar. 18, 2010 Page 279 of 982
REJ09B0054-0600

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