DF2239TF16I Renesas Electronics America, DF2239TF16I Datasheet - Page 272

MCU 3V 384K I-TEMP 100-TQFP

DF2239TF16I

Manufacturer Part Number
DF2239TF16I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of DF2239TF16I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
16MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2239TF16I
HD64F2239TF16I
Section 8 DMA Controller (DMAC)
Rev. 6.00 Mar. 18, 2010 Page 210 of 982
REJ09B0054-0600
Bit
5
4
Bit Name
RPE
DTDIR
Initial Value
0
0
R/W
R/W
R/W
Description
Repeat Enable
Used in combination with the DTIE bit in
DMABCR to select the mode (sequential, idle,
or repeat) in which transfer is to be performed.
When DTIE = 0 (no transfer end interrupt)
0: Transfer in sequential mode
1: Transfer in repeat mode
When DTIE = 1 (with transfer end interrupt)
0: Transfer in sequential mode
1: Transfer in idle mode
Data Transfer Direction
Used in combination with the SAE bit in
DMABCR to specify the data transfer direction
(source or destination). The function of this bit
is therefore different in dual address mode and
single address mode.
When SAE = 0
0: Transfer with MAR as source address and
1: Transfer with IOAR as source address and
When SAE = 1
0: Transfer with MAR as source address and
1: Transfer with DACK pin as read strobe and
IOAR as destination address
MAR as destination address
DACK pin as write strobe
MAR as destination address

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