DF2239TF16I Renesas Electronics America, DF2239TF16I Datasheet - Page 131

• Manufacturer Part Number: DF2239TF16I
• Description: MCU 3V 384K I-TEMP 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2239TF16I

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2239TF16I; HD64F2239TF16I

• Stack Structure
In advanced mode, when the program counter (PC) is pushed onto the stack in a subroutine
call, and the PC, condition-code register (CCR), and extended control register (EXR) are
pushed onto the stack in exception handling, they are stored as shown in figure 2.4. When
EXR is invalid, it is not pushed onto the stack. For details, see section 4, Exception Handling.
SP
Notes: 1. When EXR is not used it is not stored on the stack.
2. SP when EXR is not used.
3. Ignored when returning.
(a) Subroutine Branch
Figure 2.4 Stack Structure in Advanced Mode
Reserved
(24 bits)
PC
(SP *
SP
2
Rev. 6.00 Mar. 18, 2010 Page 69 of 982
)
(b) Exception Handling
Reserved *
(24 bits)
EXR *
CCR
PC
1
1
*
3
REJ09B0054-0600
Section 2 CPU