DF2239TF16I Renesas Electronics America, DF2239TF16I Datasheet - Page 53

• Manufacturer Part Number: DF2239TF16I
• Description: MCU 3V 384K I-TEMP 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2239TF16I

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2239TF16I; HD64F2239TF16I

Figure 27.5
Figure 27.6
Figure 27.7
Figure 27.8
Figure 27.9
Figure 27.10 System Clock Timing...........................................................................................948
Figure 27.11 Oscillation Stabilization Timing ..........................................................................948
Figure 27.12 Reset Input Timing...............................................................................................949
Figure 27.13 Interrupt Input Timing..........................................................................................949
Figure 27.14 Basic Bus Timing (Two-State Access) ................................................................950
Figure 27.15 Basic Bus Timing (Three-State Access)...............................................................951
Figure 27.16 Basic Bus Timing (Three-State Access with One Wait State) .............................952
Figure 27.17 Burst ROM Access Timing (Two-State Access)..................................................953
Figure 27.18 Burst ROM Access Timing (One-State Access) ..................................................954
Figure 27.19 External Bus Release Timing ...............................................................................954
Figure 27.20 DMAC Single Address Transfer Timing (Two-State Access) .............................955
Figure 27.21 DMAC Single Address Transfer Timing (Three-State Access) ...........................956
Figure 27.22 DMAC TEND Output Timing .............................................................................957
Figure 27.23 DMAC DREQ Input Timing................................................................................957
Figure 27.24 I/O Port Input/Output Timing ..............................................................................957
Figure 27.25 TPU Input/Output Timing....................................................................................958
Figure 27.26 TPU Clock Input Timing......................................................................................958
Figure 27.27 8-Bit Timer Output Timing ..................................................................................958
Figure 27.28 8-Bit Timer Clock Input Timing ..........................................................................959
Figure 27.29 8-Bit Timer Reset Input Timing...........................................................................959
Figure 27.30 WDT_1 Output Timing........................................................................................959
Figure 27.31 SCK Clock Input Timing .....................................................................................959
Figure 27.32 SCI Input/Output Timing (Clocked Synchronous Mode) ....................................960
Figure 27.33 A/D Converter External Trigger Input Timing ....................................................960
Figure 27.34 I
Appendix C Package Dimensions
Figure C.1
Figure C.2
Figure C.3
Figure C.4
Figure C.5
Figure C.6
Power Supply Voltage and Operating Ranges
(H8S/2237 Group and H8S/2227 Group).............................................................843
Output Load Circuit .............................................................................................853
I
Output Load Circuit .............................................................................................873
Output Load Circuit .............................................................................................896
TFP-100B Package Dimensions...........................................................................973
TFP-100G Package Dimensions ..........................................................................974
FP-100A Package Dimensions.............................................................................975
FP-100B Package Dimensions .............................................................................976
BP-112 Package Dimensions ...............................................................................977
TBP-112A, TBP-112AV Package Dimensions....................................................978
2
2
C Bus Interface Input/Output Timing (Optional)...............................................859
C Bus Interface Input/Output Timing (Optional)...............................................960
Rev. 6.00 Mar. 18, 2010 Page li of lx
REJ09B0054-0600