DF2239TF16I Renesas Electronics America, DF2239TF16I Datasheet - Page 920

MCU 3V 384K I-TEMP 100-TQFP

DF2239TF16I

Manufacturer Part Number
DF2239TF16I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of DF2239TF16I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
16MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2239TF16I
HD64F2239TF16I
Section 27 Electrical Characteristics
Table 27.9 I
Conditions:
Item
SCL input cycle time
SCL input high pulse width
SCL input low pulse width
SCL, SDA input rise time
SCL, SDA input fall time
SCL, SDA input spike pulse
elimination time
SDA input bus free time
Start condition input hold
time
Retransmission start
condition input setup time
Stop condition input setup
time
Data input setup time
Data input hold time
SCL, SDA load capacitance
Note:
Rev. 6.00 Mar. 18, 2010 Page 858 of 982
REJ09B0054-0600
* Can be 7.5 t
see section 16.6, Usage Notes.
V
T
2
C Bus Timing
a
CC
= –20°C to +75°C
= 4.0 V to 5.5 V, V
cyc
or 17.5 t
t
t
t
t
t
t
t
t
t
t
t
t
C
Symbol
SCL
SCLH
SCLL
Sr
Sf
SP
BUF
STAH
STAS
STOS
SDAS
SDAH
b
cyc
depending on the clock used in the I
SS
= 0 V, φ = 5 MHz to maximum operating frequency,
Min
12
3
5
5
3
3
3
0.5
0
Standard Value
Typ
Max
7.5 *
300
1
400
Unit
t
t
t
t
ns
t
t
t
t
t
t
ns
pF
cyc
cyc
cyc
cyc
cyc
cyc
cyc
cyc
cyc
cyc
2
C module. For details,
Test Conditions
Figure 27.7

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