DF2239TF16I Renesas Electronics America, DF2239TF16I Datasheet - Page 12

• Manufacturer Part Number: DF2239TF16I
• Description: MCU 3V 384K I-TEMP 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2239TF16I

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 16MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2239TF16I; HD64F2239TF16I

Item
2.3 Address Space
Figure 2.5 Memory Map
2.6 Instruction Set
Table 2.1 Instruction
Classification
2.6.1 Table of Instructions
Classified by Function
Table 2.3 Data Transfer
Instructions
Rev. 6.00 Mar. 18, 2010 Page x of lx
REJ09B0054-0600
Page
70
79
81
Revision (See Manual for Details)
Figure amended
Table amended
Note added
Notes:
Table amended
Note amended
Notes: 1. Refers to the operand size.
Function
Data transfer
Instruction
LDM *
STM *
2
2
2. Only register ER0 to ER6 should be used when
B:
W: Word
L:
5.
Size *
L
L
using the STM/LDM instruction.
H'00FFFFFF
H'FFFFFFFF
H'00000000
using the STM/LDM instruction.
Only register ER0 to ER6 should be used when
Byte
Longword
Instructions
MOV
POP *
LDM *
1
Function
@SP+
Pops two or more general registers from the stack.
Rn (register list)
Pushes two or more general registers onto the stack.
1
5
, PUSH *
, STM *
→
5
1
(b) Advanced Mode
Rn (register list)
Not available
16 Mbytes
in this LSI
→
@–SP
Program area
Data area
Size
B/W/L
W/L
L
Types
5