DF2239TF16I Renesas Electronics America, DF2239TF16I Datasheet - Page 779

MCU 3V 384K I-TEMP 100-TQFP

DF2239TF16I

Manufacturer Part Number
DF2239TF16I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of DF2239TF16I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
16MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2239TF16I
HD64F2239TF16I
The differences between boot mode and user program mode are shown in table 20.1.
Figure 20.3 shows the operation flow for boot mode and figure 20.4 shows that for user program
mode.
Table 20.1 Differences between Boot Mode and User Program Mode
Note:
Total erase
Block erase
Programming control program*
* To be provided by the user, in accordance with the recommended algorithm.
Notes: Only make a transition between user mode and user program mode when the CPU is
FWE = 1
User mode
not accessing the flash memory.
1. RAM emulation possible
2. In the H8S/2258, H8S/2239, H8S/2238B, and H8S/2238R, MD0 = 0, MD1 = 0, MD2 = 0,
3. In the H8S/2227 Group, MD0 = 0, MD1 = 0, MD2 = 0, P14 = 0, P16 = 0, PF0 = 1, PF3 = 1.
P14 = 0, P16 = 0, PF0 = 1.
On-board programming mode
program mode
FWE = 0
User
Figure 20.2 Flash Memory State Transitions
MD1 = 1,
MD2 = 1,
FWE = 0 *
MD1 = 1,
MD2 = 1,
FWE = 1
*
RES = 0
1
1
Boot Mode
Yes
No
Program/program-verify
RES = 0
MD1 = 1,
MD2 = 0,
FWE = 1
Reset state
Boot mode
Section 20 Flash Memory (F-ZTAT Version)
RES = 0
Rev. 6.00 Mar. 18, 2010 Page 717 of 982
*
2
*
3
RES = 0
User Program Mode
Yes
Program/program-verify/erase/
erase-verify/emulation
Yes
Programmer
mode
REJ09B0054-0600

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