M306N4FGGP#U3 Renesas Electronics America, M306N4FGGP#U3 Datasheet - Page 406

• Manufacturer Part Number: M306N4FGGP#U3
• Description: IC M16C/6N4 MCU FLASH 100-LQFP
• Manufacturer: Renesas Electronics America
• Series: M16C™ M16C/6Nr

Specifications of M306N4FGGP#U3

• Core Processor: M16C/60
• Core Size: 16-Bit
• Speed: 24MHz
• Connectivity: CAN, I²C, IEBus, SIO, UART/USART
• Peripherals: DMA, WDT
• Number Of I /o: 85
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 10K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 26x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Package: 100LQFP
• Family Name: M16C
• Maximum Speed: 24 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 16|32 Bit
• Number Of Programmable I/os: 87
• Interface Type: I2C/UART
• On-chip Adc: 26-chx10-bit
• On-chip Dac: 2-chx8-bit
• Number Of Timers: 11
• For Use With: R0K3306NKS001BE - KIT DEV RSK RSK-M16C/6NKR0K3306NKS000BE - KIT DEV RSK RSK-M16C/6NK
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

2.00 Nov. 10, 2004
Rev.
Date
REVISION HISTORY
296, 297 Figures 22.6 and 22.7 Timing Diagram (3) (4): "DB" in Read timing is revised to "DBi".
298, 299 Figures 22.8 and 22.9 Timing Diagram (5) (6): "DB" in Write timing is revised to "DBi".
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Figure 21.18 Pin Connections for CAN I/O Mode (2) is added.
Table 21.9 Flash Memory Version Electrical Characteristics
Table 22.1 Absolute Maximum Ratings
Table 22.3 Recommended Operating Conditions (2)
Figure 22.1 Timing of Voltage Fluctuation is added.
Table 22.4 Electrical Characteristics (1): Hysteresis
Table 22.6 A/D Conversion Characteristics: "Tolerance Level Impedance" is added.
Table 22.8 Power Supply Circuit Timing Characteristics: "t
Figure 22.2 Power Supply Circuit Timing Diagram is added.
Table 22.10 Memory Expansion Mode and Microprocessor Mode: "t
Table 22.21 Serial I/O: Min. of standard in t
Table 22.23 Memory Expansion Mode and Microprocessor Mode (for setting with no wait)
Table 22.24 Memory Expansion Mode and Microprocessor Mode (for 1- to 3-wait setting
and external area access)
Table 22.25 Memory Expansion Mode and Microprocessor Mode (for 2- to 3-wait setting,
external area access and multiplexed bus selection)
Figure 22.4 Timing Diagram (1): "XIN input" is added.
Figure 22.11 Timing Diagram (8)
23.1 External Bus: The description of the external ROM version is deleted.
23.2 PLL Frequency Synthesizer is revised.
23.3 Power Control
23.8.2.1 Special Mode 1 (I
23.8.3 SI/O3 is added.
• Parameter is added and the value of some item is revised.
• "Flash Program Erase" in Operating Ambient Temperature is added.
• Parameters of Power Supply Ripple are added.
• NOTE 4 is revised.
• "CLK4" is revised to "CLK3", and "TA2OUT" is revised to "TA0OUT".
•
• XIN is added.
• Max. of Standard in t
• t
• Max. of Standard in t
• t
• t
• Max. of Standard in t
• "ADi/DB" in Read/Write timing is revised to "ADi/DBi".
• 2nd item is added. (Set the MR0 bit in the TAiMR register to •••)
• 4th item is revised. (Wait for main clock oscillation •••)
• Section of "External clock" is deleted.
Max. of Standard in RESET is revised from "2.2" to "2.5".
d(BCLK-HLDA)
d(BCLK-HLDA)
d(BCLK-HLDA)
is added.
is added.
is added.
M16C/6N Group (M16C/6N4) Hardware Manual
____________
d(BCLK-ALE)
d(BCLK-ALE)
d(BCLK-ALE)
C-6
2
C Mode) is added.
Description
is revised from "25" to "15".
is revised from "25" to "15".
is revised from "25" to "15".
Summary
su(D-C)
is revised from "30" to "70".
d(M-L)
" is deleted.
d(BCLK-HLDA)
" is deleted.