LPC2460FET208,551 NXP Semiconductors, LPC2460FET208,551 Datasheet - Page 415

• Manufacturer Part Number: LPC2460FET208,551
• Description: IC ARM7 MCU ROMLESS 208TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2460FET208,551

• Program Memory Type: ROMless
• Package / Case: 208-TFBGA
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 160
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB2460, MCB2460U
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCB2400U - BOARD EVAL MCB2400 + ULINK2MCB2400 - BOARD EVAL FOR NXP LPC246X SER
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4260; 935283232551; LPC2460FET208-S

NXP Semiconductors
UM10237_4
User manual
8.2 A-device: host to peripheral HNP switching
/* Wait for TDI to be set */
while (!(OTG_I2C_STS & TDI));
/* Clear TDI */
OTG_I2C_STS = TDI;
Add D+ pull-up
/* Add D+ pull-up through ISP1302 */
OTG_I2C_TX = 0x15A; // Send ISP1302 address, R/W=0
OTG_I2C_TX = 0x006; // Send OTG Control (Set) register address
OTG_I2C_TX = 0x201; // Set DP_PULLUP bit, send STOP condition
/* Wait for TDI to be set */
while (!(OTG_I2C_STS & TDI));
/* Clear TDI */
OTG_I2C_STS = TDI;
In this case, the role of the OTG controller is host (A-device), and the A-device switches
roles from host to peripheral.
The On-The-Go Supplement defines the behavior of a dual-role A-device during HNP
using a state machine diagram. The OTG software stack is responsible for implementing
all of the states in the Dual-Role A-Device State Diagram.
The OTG controller hardware provides support for the state transitions between a_host,
a_suspend, a_wait_vfall, and a_peripheral in the Dual-Role A-Device state diagram.
Setting A_HNP_TRACK in the OTGStCtrl register enables hardware support for switching
the A-device from the host state to the device state. The hardware actions after setting
this bit are shown in
Figure
Rev. 04 — 26 August 2009
15–62.
Chapter 15: LPC24XX USB OTG controller
UM10237
© NXP B.V. 2009. All rights reserved.
415 of 792