LPC2460FET208,551 NXP Semiconductors, LPC2460FET208,551 Datasheet - Page 91

• Manufacturer Part Number: LPC2460FET208,551
• Description: IC ARM7 MCU ROMLESS 208TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2460FET208,551

• Program Memory Type: ROMless
• Package / Case: 208-TFBGA
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 160
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, MCB2460, MCB2460U
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCB2400U - BOARD EVAL MCB2400 + ULINK2MCB2400 - BOARD EVAL FOR NXP LPC246X SER
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4260; 935283232551; LPC2460FET208-S

NXP Semiconductors
UM10237_4
User manual
10.20 Dynamic Memory RAS & CAS Delay registers
Table 87.
A chip select can be connected to a single memory device, in this case the chip select
data bus width is the same as the device width. Alternatively the chip select can be
connected to a number of external devices. In this case the chip select data bus width is
the sum of the memory device data bus widths.
For example, for a chip select connected to:
The SDRAM bank select pins BA1 and BA0 are connected to address lines A14 and A13,
respectively.
(EMCDynamicRASCAS0-3 - 0xFFE0 8104, 124, 144, 164)
The EMCDynamicRasCas0-3 registers enable you to program the RAS and CAS
latencies for the relevant dynamic memory. It is recommended that these registers are
modified during system initialization, or when there are no current or outstanding
transactions. This can be ensured by waiting until the EMC is idle, and then entering
low-power, or disabled mode. These registers are accessed with one wait state.
Note: The values programmed into these registers must be consistent with the values
used to initialize the SDRAM memory device.
Table 5–88
Table 88.
14
1
1
1
Bit
1:0
7:2
•
•
•
•
a 32 bit wide memory device, choose a 32 bit wide address mapping.
a 16 bit wide memory device, choose a 16 bit wide address mapping.
four x 8 bit wide memory devices, choose a 32 bit wide address mapping.
two x 8 bit wide memory devices, choose a 16 bit wide address mapping.
12
1
1
1
Symbol
RAS latency
(active to
read/write
delay) (RAS)
-
11:9 8:7
011
100
100
Address mapping
Dynamic Memory RAS & CAS Delay registers (EMCDynamicRasCas0-3 - address
0xFFE0 8104, 0xFFE0 8124, 0xFFE0 8144, 0xFFE0 8164) bit description
shows the bit assignments for the EMCDynamicRasCas0-3 registers.
10
00
01
Description
256 MB (8Mx32), 4 banks, row length = 13, column length = 8
512 MB (64Mx8), 4 banks, row length = 13, column length = 11
512 MB (32Mx16), 4 banks, row length = 13, column length = 10
Rev. 04 — 26 August 2009
Value Description
00
01
10
11
-
Chapter 5: LPC24XX External Memory Controller (EMC)
Reserved.
One CCLK cycle.
Two CCLK cycles.
Three CCLK cycles (POR reset value).
Reserved, user software should not write ones to
reserved bits. The value read from a reserved bit is not
defined.
UM10237
© NXP B.V. 2009. All rights reserved.
91 of 792
Reset
Value
11
NA