EVB9S12XEP100 Freescale Semiconductor, EVB9S12XEP100 Datasheet - Page 1260

• Manufacturer Part Number: EVB9S12XEP100
• Description: BOARD EVAL FOR MC9S12XEP100
• Manufacturer: Freescale Semiconductor
• Type: MCUr

Specifications of EVB9S12XEP100

• Contents: Module and Misc Hardware
• Processor To Be Evaluated: MC9S12XEP100
• Data Bus Width: 16 bit
• Interface Type: RS-232
• Silicon Manufacturer: Freescale
• Core Architecture: S12
• Core Sub-architecture: S12
• Silicon Core Number: MC9S12
• Silicon Family Name: S12XE
• Rohs Compliant: Yes
• For Use With/related Products: MC9S12XEP100
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Appendix B Package Information
B.1
B.2
1260
208 MAPBGA
144-Pin LQFP
0.3
0.1
Figure B-1. 208MAPBGA Mechanical Dimensions
208X
M
M
3
X
Z
MC9S12XE-Family Reference Manual , Rev. 1.23
Y
b
15X e
Z
S
E
X
16
15
14
0.2
13
12
VIEW M M
11
LASER MARK FOR PIN A1
IDENTIFICATION IN THIS AREA
4X
10
9
D
8
7
6
S
15X e
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
CASE 1159A-01
X
METALIZED MARK FOR PIN A1
IDENTIFICATION IN THIS AREA
ISSUE B
M
M
A
K
A1
A2
NOTES:
(ROTATED 90° CLOCKWISE)
1.
2.
3.
4.
5.
Z
DIM
A1
A2
A
D
E
S
ALL DIMENSIONS ARE IN MILLIMETERS.
INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
DATUM Z (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
PARALLELISM MEASEMENT SHALL EXCLUDE ANY
EFFECT OF MARK ON TOP SURFACE OF PACKAGE.
b
e
4
MILLIMETERS
MIN
0.40
1.00
0.50
VIEW K
---
17.00 BSC
17.00 BSC
1.00 BSC
0.50 BSC
MAX
2.00
0.60
1.30
0.70
DATE 12/12/98
0.2 Z
5
0.2
Z
208X
Freescale Semiconductor