HD64F2145BTE20 Renesas Electronics America, HD64F2145BTE20 Datasheet - Page 696

IC H8S MCU FLASH 256K 100-QFP

HD64F2145BTE20

Manufacturer Part Number
HD64F2145BTE20
Description
IC H8S MCU FLASH 256K 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheets

Specifications of HD64F2145BTE20

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, IrDA, SCI, X-Bus
Peripherals
PWM, WDT
Number Of I /o
74
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Section 24 Clock Pulse Generator
24.8
The X1 and X2 pins should be open as shown in figure 24.8.
24.9
24.9.1
Since all kinds of characteristics of the resonator are closely related to the board design by the
user, use the example of resonator connection in this document for only reference; be sure to use
an resonator that has been sufficiently evaluated by the user. Consult with the resonator
manufacturer about the resonator circuit ratings which vary depending on the stray capacitances of
the resonator and installation circuit. Make sure the voltage applied to the oscillator pins does not
exceed the maximum rating.
24.9.2
When using a crystal resonator, the crystal resonator and its load capacitors should be placed as
close as possible to the XTAL and EXTAL pins.
Other signal lines should be routed away from the oscillator circuit to prevent inductive
interference with the correct oscillation as shown in figure 24.9.
Rev. 3.00 Mar 21, 2006 page 640 of 788
REJ09B0300-0300
Processing for X1 and X2 Pins
Usage Notes
Note on Resonator
Notes on Board Design
Figure 24.9 Note on Board Design of Oscillator Circuit Section
Figure 24.8 Processing for X1 and X2 Pins
Avoid
C
C
L2
L1
Signal A Signal B
X1
X2
Open
Open
XTAL
EXTAL
This LSI

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