MPCBL0050N02Q Intel, MPCBL0050N02Q Datasheet - Page 237

• Manufacturer Part Number: MPCBL0050N02Q
• Manufacturer: Intel

Specifications of MPCBL0050N02Q

• Lead Free Status / RoHS Status: Supplier Unconfirmed

Specifications—MPCBL0050
11.6
11.7
September 2007
Order Number: 318146-001
Cooling Requirements
The MPCBL0050 SBC should be installed vertically in a chassis, with bottom-to-top
airflow. Airflow is expected to be distributed across the bottom edge of the installed
MPCBL0050 blade and to maintain at least 30 cubic feet per minute (CFM) airflow.
Thermals
The curve of the pressure drop versus the flow rate in
impedance of the slot. This information is provided in accordance with Section 5 of the
PICMG 3.0 Specification to aid system integrators in using the Intel NetStructure
MPCBL0050 Single Board Computer in various AdvancedTCA* shelves.
• Most components on the MPCBL0050 blade are specified to operate with a localized
• The MPCBL0050 blade uses custom heat sinks designed by Intel. The following are
• The rate of airflow specified above is critical to ensuring that the blade operates as
ambient temperature up to 70° C and do not require heat sinks.
the on-board components that have heat sinks installed:
designed.
— Middle planes 9 an 10 are 2 oz. copper.
— All others are 1 oz. copper.
— Processors
— GbE Controllers (Intel
— Memory Controller Hub (Intel
— I/O Controller Hub (Intel
®
82571EB Gigabit Ethernet Controller)
®
6321ESB ICH Chipset)
®
E7520 MCH Chipset)
Intel NetStructure
Figure 53
®
MPCBL0050 Single Board Computer
Technical Product Specification
represents the flow
®
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