MPCBL0050N02Q Intel, MPCBL0050N02Q Datasheet - Page 63

• Manufacturer Part Number: MPCBL0050N02Q
• Manufacturer: Intel

Specifications of MPCBL0050N02Q

• Lead Free Status / RoHS Status: Supplier Unconfirmed

Operating the Unit—MPCBL0050
Warning:
Figure 25.
September 2007
Order Number: 318146-001
To meet safety requirements, this configuration MUST be used if the board is operating
in an environment with an operating voltage at or above -60V. For further explanation
of this matter, refer to the Official Customer Notification of Changes to the Default
Grounding Configuration of MPCBL0050 Products document included with the
MPCBL0050.
If the board operates with a standard -48V power supply, however, this connection is
not required and can be removed using the procedure below.
Digital ground to chassis ground standoff location
To disconnect the digital ground from the chassis ground:
1. Confirm that the board and service person are appropriately grounded prior to
2. Using a Philips head screwdriver, remove the screws from the memory top cover
3. Using a flat-head screw driver, remove the standoff (metal cylinder) located beside
chassis ground connection
Digital ground to
removing the board from the ESD bag.
and then from the cover itself (see
the RTM power connector J3 under the FBDIMM cover, as shown in
— To avoid confusion, now put the removed standoff away somewhere safely. It
will not be needed further in this procedure. The removed standoff would only
be needed again to reverse the current procedure (to once again connect the
digital ground to the chassis ground).
Section 4.5
Intel NetStructure
for details on cover removal).
®
MPCBL0050 Single Board Computer
Technical Product Specification
Figure
25.
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