HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 196

• Manufacturer Part Number: HD64F2676VFC33
• Description: IC H8S MCU FLASH 256K 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of HD64F2676VFC33

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: IrDA, SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 103
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 6 Bus Controller (BSC)
Bit
6.3.9
DRACCR is used to set the DRAM/synchronous DRAM interface bus specifications.
Note: The synchronous DRAM interface is not supported in the H8S/2678 Group.
Rev. 3.00 Mar 17, 2006 page 144 of 926
REJ09B0283-0300
Address
RAST = 0 RAS
RAST = 1 RAS
UCAS, LCAS
Bit Name
DRAM Access Control Register (DRACCR)
(2-State Column Address Output Cycle, Full Access)
Initial Value
Figure 6.4 RAS
T
p
Row address
RAS Signal Assertion Timing
RAS
RAS
R/W
T
Description
111: 11-bit shift
r
Bus cycle
When 8-bit access space is designated:
Row address bits A23 to A11 used for
comparison
When 16-bit access space is designated:
Row address bits A23 to A12 used for
comparison
The precharge-sel is A15 to A12 of the
column address.
T
c1
Column address
T
c2