HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 263

IC H8S MCU FLASH 256K 144-QFP

HD64F2676VFC33

Manufacturer Part Number
HD64F2676VFC33
Description
IC H8S MCU FLASH 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2676VFC33

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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6.7.11
When synchronous DRAM with a 16-bit configuration is connected, DQMU and DQML are
used for the control signals needed for byte access.
Figures 6.49 and 6.50 show the control timing for DQM, and figure 6.51 shows an example of
connection of byte control by DQMU and DQML.
Upper data bus
Lower data bus
Precharge-sel
Address bus
Byte Access Control
SDRAM
DQMU
DQML
CKE
RAS
CAS
WE
(Upper Byte Write Access: SDWCD = 0, CAS Latency 2)
Figure 6.49 DQMU and DQML Control Timing
Column address
PALL
T
p
Row address
Row address
ACTV
T
r
High
High
NOP
T
c1
Rev. 3.00 Mar 17, 2006 page 211 of 926
Column address
WRIT
High-Z
T
Section 6 Bus Controller (BSC)
cl
NOP
T
c2
REJ09B0283-0300

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