HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 292

IC H8S MCU FLASH 256K 144-QFP

HD64F2676VFC33

Manufacturer Part Number
HD64F2676VFC33
Description
IC H8S MCU FLASH 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2676VFC33

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Section 6 Bus Controller (BSC)
Idle Cycle in Case of Normal Space Access after DRAM Space Access:
While the DRMI bit is cleared to 0 in DRACCR, idle cycle insertion after DRAM space access is
disabled. Idle cycle insertion after DRAM space access can be enabled by setting the DRMI bit to
1. The conditions and number of states of the idle cycle to be inserted are in accordance with the
settings of bits ICIS1, ICIS0, and IDLC in BCR are valid. Figures 6.76 and 6.77 show examples of
idle cycle operation when the DRMI bit is set to 1.
Rev. 3.00 Mar 17, 2006 page 240 of 926
REJ09B0283-0300
Precharge-sel
DQMU, DQML
Address bus
Normal space access after DRAM space read access
HWR, LWR
Data bus
CKE
CAS
RAS
WE
RD
Figure 6.75 Example of Idle Cycle Operation in RAS Down Mode
PALL ACTV READ
address
Column
T
p
(Write after Read) (IDLC = 0, CAS Latency 2)
Continuous synchronous
DRAM space read
address
address
Row
Row
T
r
T
Column address 1
c1
T
cl
High
High
T
c2
External space read
T
External address
External address
1
NOP
T
2
T
3
Idle cycle
T
Continuous synchronous
DRAM space write
i
Column address 2
T
c1
WRIT
T
Cl
NOP
T
c2

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