HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 859

• Manufacturer Part Number: HD64F2676VFC33
• Description: IC H8S MCU FLASH 256K 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of HD64F2676VFC33

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: IrDA, SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 103
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 19 Flash Memory (F-ZTAT Version)
19.13
Note on Switching from F-ZTAT Version to Masked ROM Version
Care is required if application software developed on the F-ZTAT version is used when the F-
ZTAT version is switched to the masked ROM version product.
If an address in which a register for the F-ZTAT version is present is read (see section 23.1,
Register Addresses (by functional module, in order of the corresponding section numbers)) in the
masked ROM version, an undefined value will be returned.
If application software developed on the F-ZTAT version is used in the masked ROM version
product, the state of the FWE pin cannot be judged. The program must be modified so that the part
of reprogramming (erasing/programming) the flash memory and the part of the RAM emulation
are not started.
Also, the mode pin of boot mode must not be set in the masked ROM version.
Note: This note is applied to all products in the F-ZTAT version and in the masked ROM
version of same Group with the different ROM size.
Rev. 3.00 Mar 17, 2006 page 807 of 926
REJ09B0283-0300