HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 729
HD64F2676VFC33
Manufacturer Part Number
HD64F2676VFC33
Description
IC H8S MCU FLASH 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Specifications of HD64F2676VFC33
Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
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20 000
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Note:
Bit
2
1
0
Bit Name
TEND
MPB
MPBT
* Only 0 can be written, to clear the flag.
Initial Value
1
0
0
R/W
R
R
R/W
Section 15 Serial Communication Interface (SCI, IrDA)
Description
Transmit End
This bit is set to 1 when no error signal has been
sent back from the receiving end and the next
transmit data is ready to be transferred to TDR.
[Setting conditions]
Timing to set this bit differs according to the
register settings.
GM = 0, BLK = 0: 2.5 etu after transmission
GM = 0, BLK = 1: 1.5 etu after transmission
GM = 1, BLK = 0: 1.0 etu after transmission
GM = 1, BLK = 1: 1.0 etu after transmission
[Clearing conditions]
Multiprocessor Bit
This bit is not used in Smart Card interface mode.
Multiprocessor Bit Transfer
Write 0 to this bit in Smart Card interface mode.
When the TE bit in SCR is 0 and the ERS bit
is also 0
If the ERS bit is 0 and the TDRE bit is 1 after
the specified interval after transmission of 1-
byte data
When 0 is written to TEND after reading TEND
= 1
When the DMAC or DTC is activated by a TXI
interrupt and writes data to TDR
Rev. 3.00 Mar 17, 2006 page 677 of 926
REJ09B0283-0300
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