HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 248

• Manufacturer Part Number: HD64F2676VFC33
• Description: IC H8S MCU FLASH 256K 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of HD64F2676VFC33

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: IrDA, SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 103
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 6 Bus Controller (BSC)
or EXDMAC single address mode at the same time, these bits select whether or not burst access is
to be performed.
When DDS = 1 or EDDS = 1: Burst access is performed by determining the address only,
irrespective of the bus master. With the DRAM interface, the DACK or EDACK output goes low
from the T
Figure 6.41 shows the DACK or EDACK output timing for the DRAM interface when DDS = 1 or
EDDS = 1.
Rev. 3.00 Mar 17, 2006 page 196 of 926
REJ09B0283-0300
Figure 6.41 Example of DACK
Read
Write
Note: n = 2 to 5
c1
DACK or EDACK
state.
Address bus
RASn (CSn)
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
DACK/EDACK
DACK
DACK
(RAST = 0, CAST = 0)
T
EDACK Output Timing when DDS = 1 or EDDS = 1
EDACK
EDACK
p
Row address
High
High
T
r
T
c1
Column address
T
c2