HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 318

IC H8S MCU FLASH 256K 144-QFP

HD64F2676VFC33

Manufacturer Part Number
HD64F2676VFC33
Description
IC H8S MCU FLASH 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2676VFC33

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Section 7 DMA Controller (DMAC)
Bit
5
4
3
2
1
0
Rev. 3.00 Mar 17, 2006 page 266 of 926
REJ09B0283-0300
Bit Name
RPE
DTDIR
DTF3
DTF2
DTF1
DTF0
Initial Value
0
0
0
0
0
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Description
Repeat Enable
Used in combination with the DTIE bit in
DMABCR to select the mode (sequential, idle,
or repeat) in which transfer is to be performed.
0: Transfer in sequential mode
1: Transfer in repeat mode
0: Transfer in sequential mode
1: Transfer in idle mode
Data Transfer Direction
Used in combination with the SAE bit in
DMABCR to specify the data transfer direction
(source or destination). The function of this bit
is therefore different in dual address mode and
single address mode.
0: Transfer with MAR as source address and
1: Transfer with DACK pin as read strobe and
0: Transfer with MAR as source address and
1: Transfer with IOAR as source address and
Data Transfer Factor 3 to 0
These bits select the data transfer factor
(activation source). There are some differences
in activation sources for channel A and channel
B.
DACK pin as write strobe
MAR as destination address
IOAR as destination address
MAR as destination address
When DTIE = 0 (no transfer end interrupt)
When DTIE = 1 (with transfer end interrupt)
When SAE = 0
When SAE = 1

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