HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 233

IC H8S MCU FLASH 256K 144-QFP

HD64F2676VFC33

Manufacturer Part Number
HD64F2676VFC33
Description
IC H8S MCU FLASH 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2676VFC33

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Section 6 Bus Controller (BSC)
6.6.9
Wait Control
There are two ways of inserting wait states in a DRAM access cycle: program wait insertion and
pin wait insertion using the WAIT pin.
Wait states are inserted to extend the CAS assertion period in a read access to DRAM space, and
to extend the write data setup time relative to the falling edge of CAS in a write access.
Program Wait Insertion: When the bit in ASTCR corresponding to an area designated as DRAM
space is set to 1, from 0 to 7 wait states can be inserted automatically between the T
state and T
c1
c2
state, according to the settings in registers WTCRA and WTCRB.
Pin Wait Insertion: When the WAITE bit in BCR is set to 1 and the ASTCR bit is set to 1, wait
input by means of the WAIT pin is enabled. When DRAM space is accessed in this state, a
) is first inserted. If the WAIT pin is low at the falling edge of in the last T
program wait (T
or
w
c1
state is inserted. If the WAIT pin is held low, T
T
state, another T
states are inserted until it
w
w
w
goes high.
Figures 6.26 and 6.27 show examples of wait cycle insertion timing in the case of 2-state and 3-
state column address output cycles.
Rev. 3.00 Mar 17, 2006 page 181 of 926
REJ09B0283-0300

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