HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 856

IC H8S MCU FLASH 256K 144-QFP

HD64F2676VFC33

Manufacturer Part Number
HD64F2676VFC33
Description
IC H8S MCU FLASH 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2676VFC33

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Section 19 Flash Memory (F-ZTAT Version)
Rev. 3.00 Mar 17, 2006 page 804 of 926
REJ09B0283-0300
Notes: 1. Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until
VCC
FWE
MD2 to MD0 *
RES
SWE bit
VCC
FWE
MD2 to MD0 *
RES
SWE bit
Period during which flash memory access is prohibited
(x: Wait time after setting SWE bit) *
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations prohibited)
2. See section 24.6, Flash Memory Characteristics.
3. Mode programming setup time t
power-off by pulling the pins up or down.
Figure 19.12 Power-On/Off Timing (H8S/2678 Group)
1
1
t
t
OSC1
OSC1
t
MDS
SWE set
SWE set
*
t
MDS
3
2
MDS
t
(1) Boot Mode
Wait time: x
(2) User Program Mode
Wait time: x
MDS
*
3
(min) = 200 ns
*
3
Programming/
erasing
possible
Programming/
erasing
possible
Wait time: 100 s
Wait time: 100 s
Min 0 s
SWE cleared
SWE cleared
Min 0 s
Min 0 s

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