HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 240

• Manufacturer Part Number: HD64F2676VFC33
• Description: IC H8S MCU FLASH 256K 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of HD64F2676VFC33

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: IrDA, SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 103
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 6 Bus Controller (BSC)
Rev. 3.00 Mar 17, 2006 page 188 of 926
REJ09B0283-0300
Address bus
RASn (CSn)
UCAS, LCAS
RD
OE
Data bus
Note: n = 2 to 5
If a transition is made to the all-module-clocks-stopped mode in the RAS down state, the clock
will stop with RAS low. To enter the all-module-clocks-stopped mode with RAS high, the
RCDM bit must be cleared to 0 before executing the SLEEP instruction.
self-refreshing is performed
the chip enters software standby mode
the external bus is released
the RCDM bit or BE bit is cleared to 0
Figure 6.32 Example of Operation Timing in RAS Down Mode
T
Row address
p
DRAM space read
T
r
(RAST = 0, CAST = 0)
Column address 1
T
c1
T
c2
External address
Normal space
T
1
read
T
2
Column address 2
DRAM space
T
c1
read
T
c2