F39-EU1E Omron, F39-EU1E Datasheet - Page 212

• Manufacturer Part Number: F39-EU1E
• Description: F3S-B OPTIONAL PROGRAMMING KIT
• Manufacturer: Omron

Specifications of F39-EU1E

• Leaded Process Compatible: No
• Peak Reflow Compatible (260 C): No
• Light Curtain Type: Safety
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Courtesy of Steven Engineering, Inc.-230 Ryan Way, South San Francisco, CA 94080-6370-Main Office: [phone]-Outside Local Area: [phone]-www.stevenengineering.com
➊ Using Relays
No.
➍
➎
➏
➐
➑
When actually using Relays, unanticipated failures may occur. It is
therefore essential to test the operation is as wide of range as
possible.
Unless otherwise specified in this catalog for a particular rating or
performance value, all values are based on JIS C5442 standard
test conditions (temperature: 15 to 35°C, relative humidity: 25% to
75%, air pressure: 86 to 106 kPa). When checking operation in the
actual application, do not merely test the Relay under the load
conditions, but test it under the same conditions as in the actual
operating environment and using the actual operating conditions.
The reference data provided in this catalog represent actual
measured values taken from samples of the production line and
shown in diagrams. They are reference values only.
Ratings and performance values given in this catalog are for
individual tests and do not indicate ratings or performance values
under composite conditions.
Operating and Storage
Environments
Relay
Mounting
Operations
Handling Relays
Relays for Printed Circuit Boards
(PCBs)
Troubleshooting
Area
No. Classification No.
➀
➁
➂
http://www.ia.omron.com/
Plug-in
Relays
Printed Circuit
Board Relays
Common
Items
1
2
3
4
5
6
7
8
1
2
3
1
1
2
3
4
1
2
1
2
3
4
5
6
7
8
9
10
Operating, Storage, and Transport
Operating Atmosphere
Using Relays in an Atmosphere Containing Corrosive Gas (Silicon, Sulfuric, or Organic
Gas)
Adhesion of Water, Chemicals, Solvent, and Oil
Vibration and Shock
External Magnetic Fields
External Loads
Adhesion of Magnetic Dust
Panel-mounting Sockets
Relay Removal Direction
Terminal Soldering
Ultrasonic Cleaning
Removing the Case and Cutting Terminals
Deformed Terminals
Replacing Relays and Performing Wiring Operations
Coating and Packing
Vibration and Shock
Dropped Products
Selecting PCBs, (1) PCB Materials
Selecting PCBs, (2) PCB Thickness
Selecting PCBs, (3) Terminal Hole and Land Diameters
Mounting Space
Pattern Design for Noise Countermeasures
Shape of Lands
Pattern Conductor Width and Thickness
Conductor Pitch
Securing the PCB
Automatic Mounting of PCB Relays
➀ Ambient Temperature
➁ Mutual Magnetic Interference
➀ Noise from Coils
➁ Noise from Contacts
➂ High-frequency Patterns
(c)Copyright OMRON Corporation 2007 All Rights Reserved.
Item
Precautions for All Relays
C-9 to C-10
C-11 to
C-14
Page
C-15
C-11
C-10
C-3