F39-EU1E Omron, F39-EU1E Datasheet - Page 80
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F39-EU1E
Manufacturer Part Number
F39-EU1E
Description
F3S-B OPTIONAL PROGRAMMING KIT
Manufacturer
Omron
Datasheet
1.F39-EU1E.pdf
(865 pages)
Specifications of F39-EU1E
Leaded Process Compatible
No
Peak Reflow Compatible (260 C)
No
Light Curtain Type
Safety
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
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Courtesy of Steven Engineering, Inc.-230 Ryan Way, South San Francisco, CA 94080-6370-Main Office: (650) 588-9200-Outside Local Area: (800) 258-9200-www.stevenengineering.com
➐-10Automatic Mounting of PCB Relays
➀ Through-hole PCBs
When mounting a Relay to a PCB, take the following points into consideration for each
process. There are also certain mounting precautions for individual Relays, so refer to
the individual Relay precautions as well.
Continued next page.
Flux Application
Process 1
Placement
Process 2
Preheating
Process 4
Process 3
Soldering
Flux
Heater
http://www.ia.omron.com/
Note: For lead-free solder, perform the soldering under conditions that conform to the applicable specifications.
1. Flow soldering is recommended to assure a uniform
Applicability of Automatic Soldering
1. Do not bend any terminals of the Relay to use it as a self-clinching Relay.
2. Execute PCB processing correctly according to the PCB process diagrams.
1. The G7S has no protection against flux
2. The flux must be a non-corrosive rosin-based flux
1. Preheating is required to create the optimum
2. The following conditions apply for preheating.
Temperature
Time
solder joint.
Solder: JIS Z3282 or H63A
Solder temperature and soldering time: Approx. 250°C
(DWS: Approx. 260°C)
Solder time: 5 s max. (DWS: Approx. 2 s for first time
and approx. 3 s for second time)
Adjust the level of the molten solder so that the PCB is
not flooded with solder.
The initial performance characteristics of the Relay will be lost.
penetration, so absolutely do not use the method
shown in the diagram on the right, in which a
sponge is soaked with flux and the PCB pressed
down on the sponge. If this method is used for the
G7S, it will cause the flux to penetrate into the
Relay. Be careful even with the flux-resistant
G7SA or G7SB, because flux can penetrate into
the Relay if it is pressed too deeply into the
sponge.
suitable for the Relay's structural materials.
For the flux solvent, use an alcohol-based solvent,
which tends to be less chemically reactive.
Apply the flux sparingly and evenly to prevent
penetration into the Relay.
When dipping the Relay terminals into liquid flux,
be sure to adjust the flux level, so that the upper
surface of the PCB is not flooded with flux.
conditions for soldering.
G7S
NO
Automatic soldering
G7SA
100°C max.
1 min max.
YES
G7SB
(c)Copyright OMRON Corporation 2007 All Rights Reserved.
1. Smooth the solder with the tip of the iron, and then
2. As shown in the above illustration, solder is available
Applicability of Manual Soldering
3. Make sure that flux does not adhere anywhere
Applicability of Dipping Method
3. Do not use a Relay if it has been left at a high
Applicability of Preheating
perform the soldering under the following conditions.
Solder: JIS Z3282, H60A, or H63A
(containing rosin-based flux)
Soldering iron: Rated at 30 to 60 W
Tip temperature: 280 to 300°C
Soldering time: Approx. 3 s max.
with a cut section to prevent flux from splattering.
outside of the Relay terminals. If flux adheres to an
area such as the bottom surface of the Relay, it will
cause the insulation to deteriorate.
temperature for a long period of time due to a
circumstance such as equipment failure. These
conditions will cause the Relay's initial
characteristics to change.
G7S
YES
G7S
G7S
NO
NO
Example of incorrect method
Manual soldering
(Must be checked when spray
Sponge soaked with
flux
G7SA
Precautions for All Relays
Pressing deeply
G7SA
G7SA
Relay
flexor is used.)
YES
YES
YES
PCB
G7SB
G7SB
G7SB
Flux
Solder
C-13
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