F39-EU1E Omron, F39-EU1E Datasheet - Page 55

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➐-10Automatic Mounting of PCB Relays

➀ Through-hole PCBs

When mounting a Relay to a PCB, take the following points into consideration for each

process. There are also certain mounting precautions for individual Relays, so refer to

the individual Relay precautions as well.

Continued next page.

Flux Application

Process 1

Placement

Process 2

Preheating

Process 4

Process 3

Soldering

Flux

Heater

http://www.ia.omron.com/

Note: For lead-free solder, perform the soldering under conditions that conform to the applicable specifications.

1. Flow soldering is recommended to assure a uniform

Applicability of Automatic Soldering

1. Do not bend any terminals of the Relay to use it as a self-clinching Relay.

2. Execute PCB processing correctly according to the PCB process diagrams.

1. The G7S has no protection against flux

2. The flux must be a non-corrosive rosin-based flux

1. Preheating is required to create the optimum

2. The following conditions apply for preheating.

Temperature

Time

solder joint.

Solder: JIS Z3282 or H63A

Solder temperature and soldering time: Approx. 250°C

(DWS: Approx. 260°C)

Solder time: 5 s max. (DWS: Approx. 2 s for first time

and approx. 3 s for second time)

Adjust the level of the molten solder so that the PCB is

not flooded with solder.

The initial performance characteristics of the Relay will be lost.

penetration, so absolutely do not use the method

shown in the diagram on the right, in which a

sponge is soaked with flux and the PCB pressed

down on the sponge. If this method is used for the

G7S, it will cause the flux to penetrate into the

Relay. Be careful even with the flux-resistant

G7SA or G7SB, because flux can penetrate into

the Relay if it is pressed too deeply into the

sponge.

suitable for the Relay's structural materials.

For the flux solvent, use an alcohol-based solvent,

which tends to be less chemically reactive.

Apply the flux sparingly and evenly to prevent

penetration into the Relay.

When dipping the Relay terminals into liquid flux,

be sure to adjust the flux level, so that the upper

surface of the PCB is not flooded with flux.

conditions for soldering.

G7S

Automatic soldering

G7SA

100°C max.

1 min max.

YES

G7SB

1. Smooth the solder with the tip of the iron, and then

2. As shown in the above illustration, solder is available

Applicability of Manual Soldering

3. Make sure that flux does not adhere anywhere

Applicability of Dipping Method

3. Do not use a Relay if it has been left at a high

Applicability of Preheating

perform the soldering under the following conditions.

Solder: JIS Z3282, H60A, or H63A

(containing rosin-based flux)

Soldering iron: Rated at 30 to 60 W

Tip temperature: 280 to 300°C

Soldering time: Approx. 3 s max.

with a cut section to prevent flux from splattering.

outside of the Relay terminals. If flux adheres to an

area such as the bottom surface of the Relay, it will

cause the insulation to deteriorate.

temperature for a long period of time due to a

circumstance such as equipment failure. These

conditions will cause the Relay's initial

characteristics to change.

G7S

YES

G7S

Example of incorrect method

Manual soldering

(Must be checked when spray

Sponge soaked with

flux

G7SA

Precautions for All Relays

Pressing deeply

G7SA

Relay

flexor is used.)

YES

PCB

G7SB

Flux

Solder

C-13

F39-EU1E Omron, F39-EU1E Datasheet - Page 55

F39-EU1E

Specifications of F39-EU1E

Related parts for F39-EU1E