ATEVK1104 Atmel, ATEVK1104 Datasheet - Page 787
ATEVK1104
Manufacturer Part Number
ATEVK1104
Description
KIT DEV/EVAL FOR AVR32 AT32UC3A
Manufacturer
Atmel
Series
AVR®32r
Type
MCUr
Datasheets
1.ATAVRONE-PROBECBL.pdf
(16 pages)
2.ATEVK1104.pdf
(826 pages)
3.ATEVK1104.pdf
(90 pages)
4.ATEVK1104.pdf
(6 pages)
5.ATEVK1104.pdf
(12 pages)
Specifications of ATEVK1104
Contents
Evaluation Board, Software and Documentation
Processor To Be Evaluated
AT32UC3A3
Data Bus Width
32 bit
Interface Type
USB, SPI, USART
Silicon Manufacturer
Atmel
Core Architecture
AVR
Core Sub-architecture
AVR UC3
Silicon Core Number
AT32UC3A3256
Silicon Family Name
AVR
Kit Contents
Board CD Docs
Rohs Compliant
Yes
For Use With/related Products
AT32UC3A3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ATEVK1104
Manufacturer:
Atmel
Quantity:
135
- ATAVRONE-PROBECBL PDF datasheet
- ATEVK1104 PDF datasheet #2
- ATEVK1104 PDF datasheet #3
- ATEVK1104 PDF datasheet #4
- ATEVK1104 PDF datasheet #5
- Current page: 787 of 826
- Download datasheet (20Mb)
39. Mechanical Characteristics
39.1
39.1.1
39.1.2
32058J–AVR32–04/11
Thermal Considerations
Thermal Data
Junction Temperature
Table 39-1
Table 39-1.
The average chip-junction temperature, T
where:
• θ
• θ
• θ
• P
• T
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
1.
2.
787.
Table 39-1 on page
Consumption” on page
JA
JC
JA
JC
JA
JC
HEAT SINK
A
D
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
T
T
J
J
=
=
T
summarizes the thermal resistance data depending on the package.
= cooling device thermal resistance (°C/W), provided in the device datasheet.
T
A
A
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
× (
×
θ
787.
θ
HEATSINK
JA
767.
)
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
TQFP100
TQFP100
LQFP144
LQFP144
Package
AT32UC3A
Table 39-1 on page
43.4
39.8
Typ
5.5
8.9
”Power
J
⋅C/W
⋅C/W
in °C.
Unit
787
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