D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 223

MCU 3V 0K I-TEMP 144-QFP

D12674RVFQ33D

Manufacturer Part Number
D12674RVFQ33D
Description
MCU 3V 0K I-TEMP 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet

Specifications of D12674RVFQ33D

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33D
HD6412674RVFQ33D

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12674RVFQ33DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
6.5.6
Some external I/O devices require a setup time and hold time between address and CS signals and
strobe signals such as RD, HWR, and LWR. Settings can be made in the CSACR register to insert
states in which only the CS, AS, and address signals are asserted before and after a basic bus space
access cycle. Extension of the CS assertion period can be set for individual areas. With the CS
assertion extension period in write access, the data setup and hold times are less stringent since the
write data is output to the data bus.
RDNn = 0
RDNn = 1
Extension of Chip Select (CS
Address bus
CSn
AS
RD
Data bus
RD
Data bus
DACK,
EDACK
Figure 6.19 Example of Read Strobe Timing
CS) Assertion Period
CS
CS
T
1
Rev. 3.00 Mar 17, 2006 page 171 of 926
Bus cycle
T
2
Section 6 Bus Controller (BSC)
REJ09B0283-0300
T
3

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