D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 249

• Manufacturer Part Number: D12674RVFQ33D
• Description: MCU 3V 0K I-TEMP 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of D12674RVFQ33D

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: IrDA, SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 103
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Other names: HD6412674RVFQ33D; HD6412674RVFQ33D

When DDS = 0 or EDDS = 0: When DRAM space is accessed in DMAC or EXDMAC single
address transfer mode, full access (normal access) is always performed. With the DRAM interface,
the DACK or EDACK output goes low from the T
In modes other than DMAC or EXDMAC single address transfer mode, burst access can be used
when accessing DRAM space.
Figure 6.42 shows the DACK or EDACK output timing for the DRAM interface when DDS = 0 or
EDDS = 0.
Read
Write
Note: n = 2 to 5
Figure 6.42 Example of DACK
DACK or EDACK
Address bus
RASn (CSn)
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
DACK/EDACK
DACK
DACK
T
p
Row address
(RAST = 0, CAST = 1)
EDACK Output Timing when DDS = 0 or EDDS = 0
EDACK
EDACK
High
High
T
r
r
state.
T
Rev. 3.00 Mar 17, 2006 page 197 of 926
c1
Column address
Section 6 Bus Controller (BSC)
T
c2
REJ09B0283-0300
T
c3