D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 941

MCU 3V 0K I-TEMP 144-QFP

D12674RVFQ33D

Manufacturer Part Number
D12674RVFQ33D
Description
MCU 3V 0K I-TEMP 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet

Specifications of D12674RVFQ33D

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33D
HD6412674RVFQ33D

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12674RVFQ33DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Read
Write
EDACK0 to EDACK3
DACK0, DACK1
Notes:
A23 to A0
RAS5 to RAS2
UCAS
LCAS
OE, RD
HWR
D15 to D0
OE, RD
HWR
D15 to D0
AS
Figure 24.17 DRAM Access Timing: Three-State Access (RAST = 1)
DACK and EDACK timing: when DDS = 0 and EDDS = 0
RAS timing: when RAST = 1
t
AD
Tp
t
t
PCH1
AS2
t
CSD2
Tr
t
AH2
t
t
DACD1
EDACD1
t
t
WRD2
t
AD
WDD
Tc1
Rev. 3.00 Mar 17, 2006 page 889 of 926
t
AC7
t
Section 24 Electrical Characteristics
AS3
t
t
WCS2
t
WDS2
OED2
t
AA5
Tc2
t
CASD2
t
WCH2
t
CASW2
t
AC2
t
AH3
t
WDH3
Tc3
REJ09B0283-0300
t
RDS2
t
WRD2
t
RDH2
t
t
OED1
CASD1
t
t
t
DACD2
EDACD2
CSD3

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