D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 31

• Manufacturer Part Number: D12674RVFQ33D
• Description: MCU 3V 0K I-TEMP 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of D12674RVFQ33D

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: IrDA, SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 103
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Other names: HD6412674RVFQ33D; HD6412674RVFQ33D

22.2 Operation .......................................................................................................................... 825
22.3
22.4 Usage Notes ...................................................................................................................... 832
Section 23 List of Registers
23.1 Register Addresses
23.2 Register Bits...................................................................................................................... 844
23.3 Register States in Each Operating Mode........................................................................... 856
Section 24 Electrical Characteristics
24.1 Absolute Maximum Ratings ............................................................................................. 865
24.2 DC Characteristics ............................................................................................................ 866
24.3 AC Characteristics ............................................................................................................ 870
24.4 A/D Conversion Characteristics........................................................................................ 906
24.5 D/A Conversion Characteristics........................................................................................ 906
24.6 Flash Memory Characteristics........................................................................................... 907
24.7 Usage Note........................................................................................................................ 908
Appendix
A.
B.
C.
Index
22.1.2 Module Stop Control Registers H and L (MSTPCRH, MSTPCRL).................... 824
22.2.1 Clock Division Mode........................................................................................... 825
22.2.2 Sleep Mode .......................................................................................................... 826
22.2.3 Software Standby Mode....................................................................................... 826
22.2.4 Hardware Standby Mode ..................................................................................... 829
22.2.5 Module Stop Mode .............................................................................................. 830
22.2.6 All-Module-Clocks-Stop Mode ........................................................................... 831
22.4.1 I/O Port Status...................................................................................................... 832
22.4.2 Current Dissipation during Oscillation Stabilization Standby Period.................. 832
22.4.3 EXDMAC/DMAC/DTC Module Stop ................................................................ 832
22.4.4 On-Chip Peripheral Module Interrupts ................................................................ 832
22.4.5 Writing to MSTPCR ............................................................................................ 832
(by functional module, in order of the corresponding section numbers)........................... 833
I/O Port States in Each Pin State....................................................................................... 909
Product Lineup.................................................................................................................. 918
Package Dimensions ......................................................................................................... 919
.......................................................................................................................................... 921
Clock Output Control..................................................................................................... 831
.................................................................................................................................. 909
.............................................................................................. 833
.............................................................................. 865
Rev. 3.00 Mar 17, 2006 page xxix of l