D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 776

MCU 3V 0K I-TEMP 144-QFP

D12674RVFQ33D

Manufacturer Part Number
D12674RVFQ33D
Description
MCU 3V 0K I-TEMP 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet

Specifications of D12674RVFQ33D

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33D
HD6412674RVFQ33D

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12674RVFQ33DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 15 Serial Communication Interface (SCI, IrDA)
The timing for setting the TEND flag depends on the value of the GM bit in SMR. The TEND flag
generation timing is shown in figure 15.27.
Rev. 3.00 Mar 17, 2006 page 724 of 926
REJ09B0283-0300
TDRE
TEND
FER/ERS
I/O data
TXI
(TEND interrupt)
When GM = 1
When GM = 0
Legend:
Ds
D0 to D7
Dp
DE
Figure 15.27 TEND Flag Generation Timing in Transmission Operation
Ds
Transfer to TSR from TDR
D0 D1 D2 D3 D4 D5 D6 D7 Dp DE
Figure 15.26 Retransfer Operation in SCI Transmit Mode
: Start bit
: Data bits
: Parity bit
: Error signal
nth transfer frame
Ds
D0
D1
D2
[6]
[7]
Ds D0 D1 D2 D3 D4 D5 D6 D7 Dp
D3
Transfer to TSR from TDR
11.0etu
12.5etu
D4
Retransferred frame
D5
D6
D7
Dp
(DE)
[8]
[9]
Guard
time
DE
Ds D0 D1 D2 D3 D4
Transfer to TSR
Transfer
frame n+1
from TDR

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