D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 376

MCU 3V 0K I-TEMP 144-QFP

D12674RVFQ33D

Manufacturer Part Number
D12674RVFQ33D
Description
MCU 3V 0K I-TEMP 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet

Specifications of D12674RVFQ33D

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33D
HD6412674RVFQ33D

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12674RVFQ33DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 7 DMA Controller (DMAC)
request is cleared. After the end of the single cycle, acceptance resumes, DREQ pin low level
sampling is performed again, and this operation is repeated until the transfer ends.
7.5.11
DMAC internal-to-external dual address transfers and single address transfers can be executed at
high speed using the write data buffer function, enabling system throughput to be improved.
When the WDBE bit of BCR in the bus controller is set to 1, enabling the write data buffer
function, dual address transfer external write cycles or single address transfers and internal
accesses (on-chip memory or internal I/O registers) are executed in parallel. Internal accesses are
independent of the bus master, and DMAC dead cycles are regarded as internal accesses.
A low level can always be output from the TEND pin if the bus cycle in which a low level is to be
output from the TEND pin is an external bus cycle. However, a low level is not output from the
TEND pin if the bus cycle in which a low level is to be output from the TEND pin is an internal
bus cycle, and an external write cycle is executed in parallel with this cycle.
Figure 7.32 shows an example of burst mode transfer from on-chip RAM to external memory
using the write data buffer function.
Figure 7.33 shows an example of single address transfer using the write data buffer function. In
this example, the CPU program area is in on-chip memory.
Rev. 3.00 Mar 17, 2006 page 324 of 926
REJ09B0283-0300
Figure 7.32 Example of Dual Address Transfer Using Write Data Buffer Function
Internal read signal
External address
Internal address
Write Data Buffer Function
HWR, LWR
TEND
DMA
read
DMA
write
DMA
read
DMA
write
DMA
read
DMA
write
DMA
read
DMA
write
DMA
dead

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