D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 269

MCU 3V 0K I-TEMP 144-QFP

D12674RVFQ33D

Manufacturer Part Number
D12674RVFQ33D
Description
MCU 3V 0K I-TEMP 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet

Specifications of D12674RVFQ33D

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33D
HD6412674RVFQ33D

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12674RVFQ33DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
6.7.13
This LSI is provided with a synchronous DRAM refresh control function. Auto refreshing is used.
In addition, self-refreshing can be executed when the chip enters the software standby state.
Refresh control is enabled when any area is designated as continuous synchronous DRAM space
in accordance with the setting of bits RMTS2 to RMTS0 in DRAMCR.
Precharge-sel
DQMU, DQML
Address bus
Refresh Control
Data bus
CKE
CAS
RAS
WE
Figure 6.53 Example of Operation Timing in RAS Down Mode
PALL ACTV READ
Continuous synchronous
DRAM space read
address
Column
T
p
address
address
Row
Row
T
r
(BE = 1, CAS Latency 2)
T
c1
Column address
T
cl
T
c2
High
NOP
External
space read
External address
External address
Rev. 3.00 Mar 17, 2006 page 217 of 926
T
1
T
2
Section 6 Bus Controller (BSC)
READ
Continuous synchronous
DRAM space read
T
c1
Column address 2
T
cl
NOP
REJ09B0283-0300
T
c2

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