D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 435

MCU 3V 0K I-TEMP 144-QFP

D12674RVFQ33D

Manufacturer Part Number
D12674RVFQ33D
Description
MCU 3V 0K I-TEMP 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet

Specifications of D12674RVFQ33D

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33D
HD6412674RVFQ33D

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12674RVFQ33DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Bus cycle
CPU
operation
EDACK
ETEND
Bus cycle
Original
channel
EDACK
Original
channel
ETEND
Other
channel
transfer
request
(EDREQ)
pin
pin
CPU cycle CPU cycle
External
space
Bus release
Figure 8.33 Auto Request/Burst Mode/Normal Transfer Mode
Figure 8.34 Auto Request/Burst Mode/Normal Transfer Mode
(Contention with Another Channel/Single Address Mode)
External
space
EXDMA single
transfer cycle
(CPU Cycles/Single Address Mode/BGUP = 1)
single cycle
External
EXDMA
space
single cycle
EXDMA single
EXDMA
transfer cycle
1 bus cycle
CPU cycle
Last transfer
EXDMA single
transfer cycle
cycle
single cycle
External
EXDMA
space
Rev. 3.00 Mar 17, 2006 page 383 of 926
1 cycle
Bus
release
single cycle
EXDMA
Other channel EXDMA cycle
Section 8 EXDMA Controller
CPU cycle
Last transfer cycle
REJ09B0283-0300
single cycle
EXDMA
CPU cycle
External
release
space
Bus

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