D12674RVFQ33D Renesas Electronics America, D12674RVFQ33D Datasheet - Page 859

MCU 3V 0K I-TEMP 144-QFP

D12674RVFQ33D

Manufacturer Part Number
D12674RVFQ33D
Description
MCU 3V 0K I-TEMP 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheet

Specifications of D12674RVFQ33D

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412674RVFQ33D
HD6412674RVFQ33D

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
D12674RVFQ33DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 19 Flash Memory (F-ZTAT Version)
19.13
Note on Switching from F-ZTAT Version to Masked ROM Version
Care is required if application software developed on the F-ZTAT version is used when the F-
ZTAT version is switched to the masked ROM version product.
If an address in which a register for the F-ZTAT version is present is read (see section 23.1,
Register Addresses (by functional module, in order of the corresponding section numbers)) in the
masked ROM version, an undefined value will be returned.
If application software developed on the F-ZTAT version is used in the masked ROM version
product, the state of the FWE pin cannot be judged. The program must be modified so that the part
of reprogramming (erasing/programming) the flash memory and the part of the RAM emulation
are not started.
Also, the mode pin of boot mode must not be set in the masked ROM version.
Note: This note is applied to all products in the F-ZTAT version and in the masked ROM
version of same Group with the different ROM size.
Rev. 3.00 Mar 17, 2006 page 807 of 926
REJ09B0283-0300

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