SW00ENB-ZCC Toshiba, SW00ENB-ZCC Datasheet - Page 39
SW00ENB-ZCC
Manufacturer Part Number
SW00ENB-ZCC
Description
MCU, MPU & DSP Development Tools CASEWORKS
Manufacturer
Toshiba
Datasheet
1.SW00ENB-ZCC.pdf
(464 pages)
Specifications of SW00ENB-ZCC
Tool Type
Development Software Support
Core Architecture
870
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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4.1.2
Note 1: If you use a microcontroller device outside the 0 to 85 C range for long periods of time, contact
Note 2: For the •ja value, contact your nearest Toshiba office or authorized Toshiba dealer.
For microcontroller devices, the following junction temperature range is used for reliability
predictions:
An estimation of the chip junction temperature, Tj, can be obtained from the equation:
Tj = 0 C
Tj = Ta + Q •ja
where:
your nearest Toshiba office or authorized Toshiba dealer.
Reliability predictions for microcontroller devices
Ta = ambient temperature ( C)
Q =
•ja = package thermal resistance ( C/W)
85 C
The assumption is that the ambient temperature is not affected by any heat
transfers from the device.
chip’s average power dissipation (W)
4 Precautions and Usage Considerations Specific to Each Product Group
25
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