PNX1702EH/G,557 NXP Semiconductors, PNX1702EH/G,557 Datasheet - Page 473
PNX1702EH/G,557
Manufacturer Part Number
PNX1702EH/G,557
Description
IC MEDIA PROC 500MHZ 456-BGA
Manufacturer
NXP Semiconductors
Datasheet
1.PNX1702EHG557.pdf
(832 pages)
Specifications of PNX1702EH/G,557
Applications
Multimedia
Core Processor
TriMedia
Controller Series
Nexperia
Ram Size
208K x 8
Interface
I²C, 2-Wire Serial
Number Of I /o
61
Voltage - Supply
1.33 V ~ 1.47 V
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
456-HBGA
Operating Temperature (min)
0C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Program Memory Type
-
Lead Free Status / Rohs Status
Compliant
Other names
935281647557
PNX1702EH/G
PNX1702EH/G
PNX1702EH/G
PNX1702EH/G
- Current page: 473 of 832
- Download datasheet (8Mb)
Philips Semiconductors
Volume 1 of 1
PNX17XX_SER_1
Preliminary data sheet
2.7.3 UNDERRUN Interrupt
2.7.4 MBE Interrupt
The THRESHn_REACHED condition is ‘sticky’ and can only be cleared by software
writing a ‘1’ to the FGPO_IR_CLR.THRESHn_REACHED_ACK bit.
Remark: This interrupt is generated when the FGPO Engine finishes reading the last
sample from the threshold record/message number from main memory and NOT
when the last sample from the threshold record/message number is output.
If software fails to assign a new buffer (update FGPO_BASEn register) and perform
an interrupt acknowledge (clear BUFnDONE interrupt) before both buffers are done,
the interrupt event FGPO_IR_STATUS.UNDERRUN will be set and the output of
samples will stop.
This happens when the FGPO switches to a buffer for which:
Output continues upon receipt of either BUF1DONE_ACK or BUF2DONE_ACK or
both. Refer to
UNDERRUN condition is ‘sticky’ and can only be cleared by software writing a ‘1’ to
the UNDERRUN_ACK bit.
A Memory Bandwidth Error (MBE) interrupt is generated when no data samples care
available during a record or message transfer. During the time MBE state exists the
last valid data sample will be output on the fgpo_data pins. Therefore one or more
data samples will be added to the message until the adapter FIFO contains valid data
samples. Then sample output resumes. For example if FGPO is set to send a
message with 6 samples and an MBE occurs before D3 is output, i.e. D3 has not yet
–
–
–
–
a buffer done event has occurred and
the buffer done interrupt has not been acknowledged and
the corresponding enable bit is set and
a new record or message start event has arrived
Figure 4 on page 13-11
Rev. 1 — 17 March 2006
Chapter 13: FGPO: Fast General Purpose Output
to see which buffer output resumes from. The
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
PNX17xx Series
13-8
Related parts for PNX1702EH/G,557
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
Digital Signal Processors & Controllers - DSP, DSC MEDIA PROCESSOR PNX17XX/500MHZ
Manufacturer:
NXP Semiconductors
Part Number:
Description:
Digital Signal Processors & Controllers - DSP, DSC NEXPERIA MEDIA PROCESSOR
Manufacturer:
NXP Semiconductors
Part Number:
Description:
NXP Semiconductors designed the LPC2420/2460 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2458 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2468 microcontroller around a 16-bit/32-bitARM7TDMI-S CPU core with real-time debug interfaces that include both JTAG andembedded trace
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2470 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
NXP Semiconductors designed the LPC2478 microcontroller, powered by theARM7TDMI-S core, to be a highly integrated microcontroller for a wide range ofapplications that require advanced communications and high quality graphic displays
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The Philips Semiconductors XA (eXtended Architecture) family of 16-bit single-chip microcontrollers is powerful enough to easily handle the requirements of high performance embedded applications, yet inexpensive enough to compete in the market for hi
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The XA-S3 device is a member of Philips Semiconductors? XA(eXtended Architecture) family of high performance 16-bitsingle-chip microcontrollers
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP BlueStreak LH75401/LH75411 family consists of two low-cost 16/32-bit System-on-Chip (SoC) devices
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3130/3131 combine an 180 MHz ARM926EJ-S CPU core, high-speed USB2
Manufacturer:
NXP Semiconductors
Datasheet:
Part Number:
Description:
The NXP LPC3141 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3143 combine a 270 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors
Part Number:
Description:
The NXP LPC3152 combines an 180 MHz ARM926EJ-S CPU core, High-speed USB 2
Manufacturer:
NXP Semiconductors