PNX1702EH/G,557 NXP Semiconductors, PNX1702EH/G,557 Datasheet - Page 75

• Manufacturer Part Number: PNX1702EH/G,557
• Description: IC MEDIA PROC 500MHZ 456-BGA
• Manufacturer: NXP Semiconductors

Specifications of PNX1702EH/G,557

• Applications: Multimedia
• Core Processor: TriMedia
• Controller Series: Nexperia
• Ram Size: 208K x 8
• Interface: I²C, 2-Wire Serial
• Number Of I /o: 61
• Voltage - Supply: 1.33 V ~ 1.47 V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 456-HBGA
• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Program Memory Type: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 935281647557; PNX1702EH/G; PNX1702EH/G

Philips Semiconductors
Volume 1 of 1
10. Board Design Guidelines
PNX17XX_SER_1
Preliminary data sheet
10.1 Power Supplies Decoupling
The following sections discuss the fundamentals of board design for the PNX1700
system. The intent is to give general guidelines on the subject, not the complete in
depth coverage.
A minimum of four layers board is recommended.
Power supply regulators require large smoothing capacitors to deliver the current until
the regulator can follow the load conditions. These smoothing capacitors are typically
large electrolytic capacitors with considerable parasitic inductance, typically in the
order of 10 nH. This high inductance does not allow for rapid supply of varying
currents required in high speed processors as the PNX1700. The following
recommendations assume a load transient of up to 1 A within 2 ns which is
considered conservative for the PNX1700. However, this does guarantee adequate
decoupling.
In “high frequency” applications, each power plane VCCP, VCCM and VDD should be
decoupled with at least 10 capacitor of 0.1 F. Capacitors should be chosen such that
the total series inductance is approximately within the order of 0.2 nH (i.e. 2 nH per
capacitor). The parasitic series resistance per capacitor should be in the order of 0.1
placed as closely as possible to the power pins of the PNX1700. If board space
allows an additional ten 0.01
and VCCM planes.
For “medium frequency”, each power plane VCCP, VCCM and VDD should be
decoupled with at least 10 capacitors of 47 F. Capacitors should be chosen such
that the total series inductance is approximately with the order of 0.5 nH. The
parasitic series resistance per capacitor should be in the order of 0.1 . Aluminum or
wet “wound foil” tantalum capacitors should not be used. Instead, dry tantalum
capacitors or equivalent total series resistor and inductance capacitors like the new
ceramic or polymer tantalum can be used. Despite the larger footprint these surface
mount “medium frequency” decoupling capacitors should still be placed as closely as
physically possible to the PNX1700 power pins.
Last step before the power regulator itself is the bulk decoupling. The bulk decoupling
can be achieved with five 100 F, 220 F or even 330 F capacitors. These
capacitors usually have an inductance of 10 nH and internal equivalent series
resistance (ESR) of 0.1 . The amount and size are dependant on how fast the
regulator operates. Tantalum capacitors are preferred.
The VIA connection to the power planes should be as wide as the capacitor soldering
lead which is different from a VIA of a regular signal. The routing and VIA inductance
and resistance must be included when computing the total series inductance and
resistance. same diameter power and ground via should be used.
. Ceramic capacitors may be used. These surface mount capacitors should be
Rev. 1 — 17 March 2006
F ceramic capacitor is recommended for each VDD
Chapter 1: Integrated Circuit Data
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
PNX17xx Series
1-48