SAM3U2C Atmel Corporation, SAM3U2C Datasheet - Page 820

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SAM3U2C

Manufacturer Part Number
SAM3U2C
Description
Manufacturer
Atmel Corporation
Datasheets

Specifications of SAM3U2C

Flash (kbytes)
128 Kbytes
Pin Count
100
Max. Operating Frequency
96 MHz
Cpu
Cortex-M3
# Of Touch Channels
28
Hardware Qtouch Acquisition
No
Max I/o Pins
57
Ext Interrupts
57
Usb Transceiver
1
Quadrature Decoder Channels
1
Usb Speed
Hi-Speed
Usb Interface
Device
Spi
4
Twi (i2c)
1
Uart
4
Ssc
1
Sd / Emmc
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
8
Adc Resolution (bits)
12
Adc Speed (ksps)
384
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
36
Self Program Memory
YES
External Bus Interface
1
Dram Memory
No
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.62 to 3.6
Fpu
No
Mpu / Mmu
Yes / No
Timers
3
Output Compare Channels
3
Input Capture Channels
3
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
Yes
37.8.4
820
820
SAM3U Series
SAM3U Series
Write Operation
In write operation, the HSMCI Mode Register (HSMCI_MR) is used to define the padding value
when writing non-multiple block size. If the bit PADV is 0, then 0x00 value is used when padding
data, otherwise 0xFF is used.
If set, the bit DMAEN in the HSMCI_DMA register enables DMA transfer.
The following flowchart
DMA facilities. Polling or interrupt method can be used to wait for the end of write according to
the contents of the Interrupt Mask Register (HSMCI_IMR).
(Figure
37-9) shows how to write a single block with or without use of
6430E–ATARM–29-Aug-11
6430E–ATARM–29-Aug-11

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