ATSAM3S-EK Atmel, ATSAM3S-EK Datasheet - Page 806

no-image

ATSAM3S-EK

Manufacturer Part Number
ATSAM3S-EK
Description
KIT EVAL FOR ATSAM3S4C
Manufacturer
Atmel
Series
SAM3Sr
Type
MCUr
Datasheets

Specifications of ATSAM3S-EK

Contents
Board, Cables, Power Supply
Silicon Manufacturer
Atmel
Core Architecture
ARM
Core Sub-architecture
Cortex-M3
Kit Contents
Board
Features
TFT Colour LCD Display, SD/MMC Interface
Svhc
No SVHC (15-Dec-2010)
Rohs Compliant
Yes
For Use With/related Products
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATSAM3S-EK
Manufacturer:
Atmel
Quantity:
135
35.8.4
806
SAM3S Preliminary
Write Operation
In write operation, the HSMCI Mode Register (HSMCI_MR) is used to define the padding value
when writing non-multiple block size. If the bit PDCPADV is 0, then 0x00 value is used when
padding data, otherwise 0xFF is used.
If set, the bit PDCMODE enables PDC transfer.
The following flowchart
PDC facilities. Polling or interrupt method can be used to wait for the end of write according to
the contents of the Interrupt Mask Register (HSMCI_IMR).
(Figure
35-9) shows how to write a single block with or without use of
6500C–ATARM–8-Feb-11

Related parts for ATSAM3S-EK