MPC5125YVN400 Freescale Semiconductor, MPC5125YVN400 Datasheet - Page 27

• Manufacturer Part Number: MPC5125YVN400
• Description: IC MCU 32BIT E300 324TEPBGA
• Manufacturer: Freescale Semiconductor
• Series: MPC51xxr

Specifications of MPC5125YVN400

• Core Processor: e300
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, USB OTG
• Peripherals: DMA, WDT
• Number Of I /o: 64
• Program Memory Type: ROMless
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 1.33 V ~ 1.47 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 324-PBGA
• Processor Series: MPC51xx
• Core: e300
• Data Bus Width: 32 bit
• Development Tools By Supplier: TWR-MPC5125-KIT, TWR-SER, TWR-ELEV, TOWER
• Maximum Clock Frequency: 400 MHz
• Operating Supply Voltage: 1.4 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Data Ram Size: 32 KB
• I/o Voltage: 3.3 V
• Interface Type: CAN, I2C
• Minimum Operating Temperature: - 40 C
• Program Memory Size: 32 bit
• Cpu Speed: 400MHz
• Embedded Interface Type: CAN, I2C, SPI, UART, USB
• Digital Ic Case Style: TEPBGA
• No. Of Pins: 324
• Rohs Compliant: Yes
• Cpu Family: MPC5xx
• Device Core Size: 32b
• Frequency (max): 400MHz
• Total Internal Ram Size: 32KB
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 324
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Chapter 1
Overview
1.1
Introduction
The MPC5125 integrated processor provides a value-based computing platform for telematics vehicle
applications for OEM, aftermarket, and commercial products. The MPC5125 is also excellent for any
embedded solution that requires network connectivity, display controller, low power consumption and an
extensive I/O set. The MPC5125 has automotive qualification; therefore, all customers can expect
competitive cost, quality, reliability and availability for years to come. The MPC5125 uses the e300 CPU
core based on the Power Architecture™ instruction set.
The MPC5125 integrated processor includes one core and multiple buses, helping to avoid bandwidth
bottlenecks. The excellent balance between operating power consumption and performance allows for
lower system cost and higher reliability. The low standby power consumption also makes the product
suitable for portable applications.
The flexibility of the MPC5125 provides customers a platform for a variety of product applications. Its
rich set of integrated I/O includes Ethernet, USB 2.0, CAN, 10 programmable serial controllers, and
numerous others. The integrated display controller (DIU) allows for cost-effective support of thin film
transistor (TFT) LCD panel displays.
The MPC5125 uses the e300 CPU core, with 32 KB instruction cache and 32 KB data cache, based on the
Power Architecture™ instruction set. Wide support of Linux, RTOS, software drivers, middleware, and
application solutions from mobileGT alliance members is planned. This can greatly reduce development
lead times and expense while improving software quality. The MPC5125 is designed for application code
compatibility with current solutions on the MPC5121e/MPC5200 and for easy scalability across product
solutions.
The many embedded memory buffers help ensure balanced system performance and system bus
throughput. The performance of the MPC5125 is enhanced by having well-balanced system resources for
the integrated core, graphics and audio engines, DDR1/DDR2/SDR/Mobile DDR memory controllers and
integrated 64-channel DMA support.
Figure 1-1
shows a top-level block diagram of the MPC5125.
MPC5125 Microcontroller Reference Manual, Rev. 2
Freescale Semiconductor
1-1