MPC5125YVN400 Freescale Semiconductor, MPC5125YVN400 Datasheet - Page 959

IC MCU 32BIT E300 324TEPBGA

MPC5125YVN400

Manufacturer Part Number
MPC5125YVN400
Description
IC MCU 32BIT E300 324TEPBGA
Manufacturer
Freescale Semiconductor
Series
MPC51xxr

Specifications of MPC5125YVN400

Core Processor
e300
Core Size
32-Bit
Speed
400MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, USB OTG
Peripherals
DMA, WDT
Number Of I /o
64
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.33 V ~ 1.47 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
324-PBGA
Processor Series
MPC51xx
Core
e300
Data Bus Width
32 bit
Development Tools By Supplier
TWR-MPC5125-KIT, TWR-SER, TWR-ELEV, TOWER
Maximum Clock Frequency
400 MHz
Operating Supply Voltage
1.4 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Data Ram Size
32 KB
I/o Voltage
3.3 V
Interface Type
CAN, I2C
Minimum Operating Temperature
- 40 C
Program Memory Size
32 bit
Cpu Speed
400MHz
Embedded Interface Type
CAN, I2C, SPI, UART, USB
Digital Ic Case Style
TEPBGA
No. Of Pins
324
Rohs Compliant
Yes
Cpu Family
MPC5xx
Device Core Size
32b
Frequency (max)
400MHz
Total Internal Ram Size
32KB
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
324
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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time-frame references for both the B-Frames (HS/FS/LS Bus) and the H-Frames. At the bottom is
illustrated the relationship between the scope of an siTD description and the time references. Each
H-Frame corresponds to a single location in the periodic frame list. The implication is that each siTD is
reachable from a single periodic frame list location at a time.
Each case is described below:
Software must apply the following rules when calculating the schedule and linking the schedule data
structures into the periodic schedule:
Freescale Semiconductor
H-Frame
4
5
Case 1: One siTD is sufficient to describe and complete the isochronous split transaction because
the whole isochronous split transaction is tightly contained within a single H-Frame.
Case 2a, 2b: Although both INs and OUTs can have these footprints, OUTs always take only one
siTD to schedule. However, INs (for these boundary cases) require two siTDs to complete the
scheduling of the isochronous split transaction. The siTDX is used to always issue the start-split
and the first N complete-splits. The full-speed transaction (for these cases) can deliver data on the
full-speed bus segment during micro-frame 7 of H-Frame
The complete splits are scheduled using siTD
data must use the buffer pointer from siTD
siTD
Software must ensure that an isochronous split-transaction is started so it completes before the end
of the B-Frame.
Software must ensure that for a single full-speed isochronous endpoint, there is never a start-split
and complete-split in H-Frame, micro-frame 1. This is mandated as a rule so that case 2a and case
2b can be discriminated. According to the core USB specification, the long isochronous transaction
illustrated in Case 2b could be scheduled so the start-split was in micro-frame 1 of H-Frame N and
the last complete-split would need to occur in micro-frame 1 of H-Frame N+1. However, it is
B-Frame
5
6
Y–1
X+1
6
7
Y–1
from H-Frame
7
0
0
1
Case 1
1
2
Figure 32-69. siTD Scheduling Boundary Examples
MPC5125 Microcontroller Reference Manual, Rev. 2
H-Frame
2
Y+2
3
siTD
B-Frame
4
3
is to use siTD
X
Y
Full-Speed Transaction
4
5
Y
Case 2a
5
6
Back Pointer
6
7
X+2
X+1
7
0
's back pointer.
X+2
. The only way for the host controller to reach
0
1
(not shown). The complete-splits to extract this
1
2
H-Frame
2
siTD
3
B-Frame
Y+1
Case 2b
4
X+1
3
Universal Serial Bus Interface with On-The-Go
, or micro-frame 0 of H-Frame
Y+1
4
5
Y+1
5
6
6
7
7
0
H-Frame
0
1
B-Frame
1
2
Y+2
2
3
Y+2
32-131
Y+2
.

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